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Parylene Properties
Commonly used performance parameters of various materials
Parylene N |
Parylene C |
Parylene D |
Epoxy resin | Silicone resin |
Polyurethane UR |
Polyacrylate AR/UV |
||
Dielectric strength DC(V/mil) |
7000 |
5600 |
5500 |
900-1000 |
1100 |
1400 |
1200 |
|
Volume resistivity(W·cm) 23°C 50%RH | 1.4´1017 | 6-8´1016 | 1.2´1016 | 1012-17 | 1015-16 | 1011-15 | 1013-14 | |
Surface resistance(W) | 1013 | 1014 | 1016 | 1013 | 1013 | 1014 | ||
Permittivity |
60Hz | 2.65 | 3.15 | 2.84 | 3.5-5.0 | 2.7-3.1 | 5.3-7.8 | |
1KHz | 2.65 | 3.10 | 2.82 | 3.5-4.5 | 2.6-2.7 | 5.4-7.6 | 4-5 | |
1MHz | 2.65 | 2.95 | 2.80 | 3.3-4.0 | 2.6-2.7 | 4.2-5.2 | 3-4 | |
Dielectric loss |
60Hz | 0.0002 | 0.020 | 0.004 | 0.002-0.01 | 0.001-0.007 | 0.015-0.05 | |
1KHz | 0.0002 | 0.019 | 0.003 | 0.002-0.02 | 0.001-0.005 | 0.04-0.06 | ||
1MHZ | 0.0006 | 0.013 | 0.002 | 0.03-0.05 | 0.001-0.002 | 0.05-0.07 | 0.035-0.056 | |
1GHz | <0.007 |
Parylene C thickness(in) |
Initial measurement23°C 50%RH | Pre-circulation23°C 90%RH |
Loop 3 step 5 65°C 90%RH |
Cycle 7 step 5 65°C 90%RH |
Cycle 10 step 5 65°C 90%RH |
Cycle 10 step 7 25°C 90%RH |
0.0020 | 2.0´1014 | 1.8´1013 | 2.3´1012 | 2.5´1011 | 1.4´1011 | 7.5´1012 |
0.0015 | 5.0´1014 | 2.4´1013 | 8.6´1011 | 1.9´1011 | 1.1´1011 | 5.2´1012 |
0.0010 | 2.0´1014 | 9.2´1012 | 8.1´1011 | 3.4´1011 | 1.3´1011 | 6.3´1012 |
0.0005 | 5.0´1014 | 2.3´1013 | 4.1´1012 | 2.4´1011 | 1.1´1011 | 4.7´1012 |
0.0003 | 5.0´1014 | 2.7´1013 | 4.4´1012 | 9.0´1010 | 4.7´1010 | 2.9´1012 |
0.0001 | 5.0´1014 | 3.2´1010 | 1.3´1011 | 1.1´1011 | 6.4´1010 | 2.3´1012 |
performance |
Parylene N |
Parylene C |
Parylene D |
Epoxy resin | Silicone resin |
Polyurethane UR |
Polyacrylate | |
Tensile strength MPa | 45 | 70 | 75 | 28-91 | 5.6-7 | 1.13-70 | 32-77 | |
Yield Strength MPa | 42 | 55 | 60 | |||||
Fracture extension | 20-250 | 200 | 10 | 3-6 | 100 | 100-1000 | 3-85 | |
Density g/cm3 | 1.10-1.12 | 1.289 | 1.418 | 1.11-1.40 | 1.05-1.23 | 1.10-2.50 | ||
D Refractive index n23 |
1.661 | 1.639 | 1.669 | 1.55-1.61 | 1.43 | 1.50-1.60 | ||
Water absorption 24 hours | <0.1 | <0.1 | <0.1 | 0.08-0.15 | 0.12(7 days) | 0.02-4.50 | ||
Hardness | R85 | R80 | R80 | M80-110 |
40-45 (Shaw) |
10A-25D (Shaw) |
H-2H | |
Coefficient of friction | Static | 0.25 | 0.29 | 0.33 | 1.0 | |||
Dynamic | 0.25 | 0.29 | 0.31 | |||||
Melting point °C | 420 | 290 | 380 | Solidify~220 | Solidify | ~170 | ||
25°C Coefficient of linear expansion 10-5/°C |
6.9 | 3.5 | 3-8 | 4.5-6.5 | 25-30 | 10-20 | 0.5-15 | |
25°C Thermal conductivity104cal/cm·s·°C | 3.0 | 2.0 | 4-5 | 3.5-7.5 | 5.0 | |||
20°C Specific heat cal/g ·°C |
0.20 | 0.17 | 0.25 | 0.42 |
25°C Gas permeability (cm3(STP) ·mil)(100in2/d·atm) |
90 RH 37°C Water vapor penetration (g·mil/100in2·d) |
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H2 | N2 | O2 | CO2 | SO2 | H2S | Cl2 | ||
Parylene N | 540 | 7.7 | 39 | 214 | 1890 | 795 | 74 | 1.50 |
Parylene C | 110 | 1.0 | 7.2 | 7.7 | 11 | 13 | 0.35 | 0.21 |
Parylene D | 240 | 4.5 | 32 | 13 | 4.75 | 1.45 | 0.55 | 0.25 |
Epoxy resin | 110 | 4 | 5-10 | 8 | 6.6 | |||
Silicone resin | 45000 | 50000 | 300000 | 220 | ||||
Polyurethane | 80 | 200 | 3000 | 20.2 | ||||
Polyacrylate | 152 | 716 | 1433 | 27.8 |
Solvent | Parylene Thickness variation(%) | ||
N | C | D | |
Isopropanol | 0.3 | 0.1 | 0.1 |
Isooctane | 0.2 | 0.4 | 0.3 |
Pyridine | 0.2 | 0.5 | 0.5 |
Mixed xylene | 1.4 | 2.3 | 1.1 |
Trichloroethylene (TCE) | 0.5 | 0.8 | 0.8 |
Chlorobenzene | 1.1 | 1.5 | 1.5 |
Dichlorobenzene | 0.2 | 3.0 | 1.8 |
Trichlorotrifluoroethane | 0.2 | 0.2 | 0.2 |
Acetone | 0.3 | 0.9 | 0.4 |
2.4 Pentylenedione | 0.6 | 1.2 | 1.4 |
Deionized water | 0 | 0 | 0 |
Reagent varieties | concentration | Parylene Thickness variation(% ) | ||
N | C | D | ||
Hydrochloric acid | 10% | 0.0 | 0.0 | 0.1 |
Concentrated hydrochloric acid | 37% | 0.2 | 0.0 | 0.5 |
sulfuric acid | 10% | 0.1 | 0.3 | 0.2 |
Concentrated sulfuric acid | 95-98 | 0.2 | 0.4 | 0.8 |
Nitric acid | 10% | 0.1 | 0.1 | 0.2 |
Concentrated nitric acid | 71% | 0.2 | 0.2 | 0.5 |
Chromic acid | 10% | 0.1 | 0.1 | 0.1 |
Concentrated chromic acid | 74% | 0.3 | 0.0 | 0.2 |
Strong alkali (sodium hydroxide) | 10% | 0.1 | 0.0 | 0.1 |
Weak base (ammonium hydroxide) | 10% | 0.3 | 0.2 | 0.1 |
Material | Parylene C | Parylene N | Polytetrafluoroethylene | High impact PVC | Epoxy resin | Polyurethane |
Abrasion value | 22.5 | 8.8 | 8.4 | 24.4 | 41.9 | 59.5 |
Parylene C | Epoxy resin | Silicone resin | Polyurethane | |
Usually use thickness(mm) | 15 | 63 | 63 | 63 |
Moisture permeability/100 Inches 2 24 小时 37°C 90 RH |
0.8 |
2.8 |
120 |
4.8 |
Breakdown voltage(V) | 3500 | 5700 | 5000 | 8700 |
Insulation resistance (Ohm/cm 2) |
9.2´1013 | 6.4´1011 | 6.4´1012 | 1.3´1013 |
Thermal conductivity (Card/sec/cm 2·°C) |
~0.2 |
0.08 |
0.08 |
0.08 |
Parylene | Epoxy resin | Silicone resin | Polyurethane | Polyacrylate | |
Dielectric properties | E | M | VG | M | G |
Mechanical strength | E | VG | M | VG | G |
Thin coating uniformity | E | G | G | G | G |
Compliance | VG | L | VG | VG | M |
Abrasion resistance | E | VG | L | VG | M |
Water absorption | E | VG | M | G | G |
Solvent mildew resistance | E | VG | M | VG | L |
Salt spray resistance, corrosion resistance | E | VG | M | G-M | M-L |
Gas and moisture barrier | E | VG | M | G | VG |
Thermal expansion coefficient | E | VG | L | M | G |
Non-polluting | E | G | L | G | G |
No stress and pinholes | E | M | M | M | M |
Fixed particle effect | E | L | L | L | L |
Adhesion to substrate | G* | VG | M | G | VG |
Repairability | G* | L | M | G | VG |
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