Parylene Properties

The English name of Parylene is Parylene, a new type of protective polymer conformal coating material developed and applied by Union Carbide Co. of the United States in the mid-1960s. It is a polymer of p-xylene. According to the different molecular structure, Parylene can be divided into N type, C type, D type, F, HT type and other types. With its unique physical properties, electrical properties and biocompatibility, it is widely used in medical design and manufacturing, defense and aerospace, biomedicine, MEMS and nanotechnology, cultural relics protection and other fields, providing more and more miniaturized products Excellent protection.

Commonly used performance parameters of various materials

Table 1 Electrical characteristics
 
  Parylene
N
Parylene
C
Parylene
D
Epoxy resin Silicone resin Polyurethane
UR
Polyacrylate
AR/UV
Dielectric strength DC(V/mil)  
7000
 
5600
 
5500
 
900-1000
 
1100
 
1400
 
1200
Volume resistivity(W·cm) 23°C 50%RH 1.4´1017 6-8´1016 1.2´1016 1012-17 1015-16 1011-15 1013-14
Surface resistance(W) 1013 1014 1016 1013 1013 1014  
 
 
Permittivity
60Hz 2.65 3.15 2.84 3.5-5.0 2.7-3.1 5.3-7.8  
1KHz 2.65 3.10 2.82 3.5-4.5 2.6-2.7 5.4-7.6 4-5
1MHz 2.65 2.95 2.80 3.3-4.0 2.6-2.7 4.2-5.2 3-4
 
 
 
Dielectric loss
60Hz 0.0002 0.020 0.004 0.002-0.01 0.001-0.007 0.015-0.05  
1KHz 0.0002 0.019 0.003 0.002-0.02 0.001-0.005 0.04-0.06  
1MHZ 0.0006 0.013 0.002 0.03-0.05 0.001-0.002 0.05-0.07 0.035-0.056
1GHz   <0.007          

Table 2 Parylene C coated circuit board alternating damp heat test insulation resistance (ohm) MIL-STD-202 method 302
 
 
Parylene C thickness(in)
Initial measurement23°C 50%RH Pre-circulation23°C 90%RH Loop 3 step 5
65°C 90%RH
Cycle 7 step 5
65°C 90%RH
Cycle 10 step 5
65°C 90%RH
Cycle 10 step 7
25°C 90%RH
0.0020 2.0´1014 1.8´1013 2.3´1012 2.5´1011 1.4´1011 7.5´1012
0.0015 5.0´1014 2.4´1013 8.6´1011 1.9´1011 1.1´1011 5.2´1012
0.0010 2.0´1014 9.2´1012 8.1´1011 3.4´1011 1.3´1011 6.3´1012
0.0005 5.0´1014 2.3´1013 4.1´1012 2.4´1011 1.1´1011 4.7´1012
0.0003 5.0´1014 2.7´1013 4.4´1012 9.0´1010 4.7´1010 2.9´1012
0.0001 5.0´1014 3.2´1010 1.3´1011 1.1´1011 6.4´1010 2.3´1012

Table 3 Parylene physical and mechanical properties
 
performance Parylene
N
Parylene
C
Parylene
D
Epoxy resin Silicone resin Polyurethane
UR
Polyacrylate
Tensile strength MPa 45 70 75 28-91 5.6-7 1.13-70 32-77
Yield Strength MPa 42 55 60        
Fracture extension 20-250 200 10 3-6 100 100-1000 3-85
Density g/cm3 1.10-1.12 1.289 1.418 1.11-1.40 1.05-1.23 1.10-2.50  
 
D
Refractive index n23
1.661 1.639 1.669 1.55-1.61 1.43 1.50-1.60  
Water absorption 24 hours <0.1 <0.1 <0.1 0.08-0.15 0.12(7 days) 0.02-4.50  
Hardness R85 R80 R80 M80-110 40-45
(Shaw)
10A-25D
(Shaw)
H-2H
Coefficient of friction Static 0.25 0.29 0.33   1.0    
Dynamic 0.25 0.29 0.31      
Melting point °C 420 290 380 Solidify~220 Solidify ~170  
25°C Coefficient of linear expansion
10-5/°C
6.9 3.5 3-8 4.5-6.5 25-30 10-20 0.5-15
25°C Thermal conductivity104cal/cm·s·°C 3.0 2.0   4-5 3.5-7.5 5.0  
20°C Specific heat
cal/g ·°C
0.20 0.17   0.25   0.42  

Table 4 Parylene gas and moisture isolation
 
  25°C Gas permeability
(cm3(STP) ·mil)(100in2/d·atm)
90 RH 37°C
Water vapor penetration
(g·mil/100in2·d)
  H2 N2 O2 CO2 SO2 H2S Cl2  
Parylene N 540 7.7 39 214 1890 795 74 1.50
Parylene C 110 1.0 7.2 7.7 11 13 0.35 0.21
Parylene D 240 4.5 32 13 4.75 1.45 0.55 0.25
Epoxy resin 110 4 5-10 8       6.6
Silicone resin 45000   50000 300000       220
Polyurethane   80 200 3000       20.2
Polyacrylate   152 716 1433       27.8

Table 5 Parylene's solvent resistance 0.5-1.5mil film thickness change after immersing in various solvents for 90 minutes at room temperature (measured by infrared method)
 
Solvent Parylene Thickness variation(%)
  N C D
Isopropanol 0.3 0.1 0.1
Isooctane 0.2 0.4 0.3
Pyridine 0.2 0.5 0.5
Mixed xylene 1.4 2.3 1.1
Trichloroethylene (TCE) 0.5 0.8 0.8
Chlorobenzene 1.1 1.5 1.5
Dichlorobenzene 0.2 3.0 1.8
Trichlorotrifluoroethane 0.2 0.2 0.2
Acetone 0.3 0.9 0.4
2.4 Pentylenedione 0.6 1.2 1.4
Deionized water 0 0 0

Table 6 The thickness change of Parylene's acid and alkali corrosion resistance 0.5-1.5mil film after being immersed in various reagents for 90 minutes at room temperature (measured by infrared method)
 
Reagent varieties concentration Parylene Thickness variation(% )
N C D
Hydrochloric acid 10% 0.0 0.0 0.1
Concentrated hydrochloric acid 37% 0.2 0.0 0.5
sulfuric acid 10% 0.1 0.3 0.2
Concentrated sulfuric acid 95-98 0.2 0.4 0.8
Nitric acid 10% 0.1 0.1 0.2
Concentrated nitric acid 71% 0.2 0.2 0.5
Chromic acid 10% 0.1 0.1 0.1
Concentrated chromic acid 74% 0.3 0.0 0.2
Strong alkali (sodium hydroxide) 10% 0.1 0.0 0.1
Weak base (ammonium hydroxide) 10% 0.3 0.2 0.1

Table 7 Wear resistance of Parylene Taber abrasion machine using CS-17 Calibrase wheel 1000 g abrasion value measured by gravity
 
Material Parylene C Parylene N Polytetrafluoroethylene High impact PVC Epoxy resin Polyurethane
Abrasion value 22.5 8.8 8.4 24.4 41.9 59.5

Table 8 Comparison of performance of commonly used thickness coating
 
  Parylene C Epoxy resin Silicone resin Polyurethane
Usually use thickness(mm) 15 63 63 63
Moisture permeability/100 Inches 2
24 小时 37°C 90 RH
 
0.8
 
2.8
 
120
 
4.8
Breakdown voltage(V) 3500 5700 5000 8700
Insulation resistance
(Ohm/cm 2)
9.2´1013 6.4´1011 6.4´1012 1.3´1013
Thermal conductivity
(Card/sec/cm 2·°C)
 
~0.2
 
0.08
 
0.08
 
0.08

Table 9 Comparison of Parylene and common coating functions
 
  Parylene Epoxy resin Silicone resin Polyurethane Polyacrylate
Dielectric properties E M VG M G
Mechanical strength E VG M VG G
Thin coating uniformity E G G G G
Compliance VG L VG VG M
Abrasion resistance E VG L VG M
Water absorption E VG M G G
Solvent mildew resistance E VG M VG L
Salt spray resistance, corrosion resistance E VG M G-M M-L
Gas and moisture barrier E VG M G VG
Thermal expansion coefficient E VG L M G
Non-polluting E G L G G
No stress and pinholes E M M M M
Fixed particle effect E L L L L
Adhesion to substrate G* VG M G VG
Repairability G* L M G VG

E=excellent VG=very good G=good M=medium L=low
* Special technology has been developed to improve the adhesion between Parylene and 60 substrate

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